Skip Navigation Links
Home
About Us
ProductsExpand Products
Services
Inquiry
Contacts
Automation
Boat Loader
Package Loader
Plasma
Quadrio 1
Quadrio 5
Vesta
Philo
Instrumentation
CAM 2
Custom System
Welding System
Philo compact plasma cleaning system
 Description
Philo is developed especially for those customers who need a standard platform which cane be customized to host different applications.
The machine is built with excellent materials and all parts are inserted in a robust aluminium frame.
The model PHILO is a compact plasma cleaning system suitable for batch operation. Typical applications are:
    • Organic decontamination prior to wire bonding
    • Adhesion promoter prior to moulding
    • Adhesion promoter of die attach materials on substrates
    • Flux removal from semiconductor packages , hybrids or automotive products
    • General activation, cleaning and decontamination
    • 3”, 4” ,6” and 8” wafer cleaning
 
Specification
Dimensions:                            900 x 1600 x 1500h mm
Weight:                                  400 Kg
Power:                                   Single Phase 220-240 V 50 Hz, 2.0 KVA
Air:                                        Dry 3—6 bar
Exhaust port:                          NW25
Control:                                  PLC (6” LCD Touch screen)
CE Certified
Safety covers and interlocks

Chamber
Material:                                 Aluminium
Dimensions:                            350 x 350 x 100h mm
Maximum Product dimensions: Application dependent

Electrode system
Material:                                  Aluminium
Geometry:                               &nbspplanar
Plasma type:                            &nbspDirect

Pumping system
BOC RV12 Fomblin Oil Pump

Gas system
1 gas lines with digital Mass Flow Controller

RF system
13.56 MHz 300W generator with auto tuner


 
 Process Flow
The plasma chamber is equipped with a door to allow loading of the products.
Once in the chamber, the products are brought to vacuum, the process gas is inserted and plasma is activated.
Once the plasma time has expired, the chamber is vented.
 
 Environment
This system is suitable only for high pressure plasma processes in the range of 0.3 to 0.9 mbar and can operate only with the following gases:
    • AR/H2 95/5 %
    • N2/H2 95/5 %
    • AR/O2 in various mix ranges
    • O2
SCI Automation Pte Ltd. © Copyright 2011