The models Quadrio 4&5 are compact plasma cleaning systems suitable for stand alone operation. Typical applications are:

• Cleaning of copper leadframes prior to wire bonding
• Organic decontamination prior to wire bonding
• Adhesion promoter prior to molding
• Adhesion promoter of die attach materials on leadframes or PBGA strips
• Flux removal from semiconductor packages or hybrids
• General activation, cleaning and decontamination
• Adhesion promoter for Flip Chip packages prior to Underfill

Advantages:

• Yield and Reliability Improvement of Semiconductor Packages
• Adhesion Promoter for Wire Bond, Die Attach and Molding
• Chemical and Physical Plasma Processes
• 3D Exposure of Substrate • De-oxidation Processes
• High UPH • Low Cost of Ownership
• Low Maintenance • Environmental Friendly

Q4
UPH:                                    400
Maxi leadframe dimensions:    280 x 80 x 1 h mm
Mini leadframe dimensions:    130x25x0.1 h mm
Conveyor:                            4 lanes adjustable in width
Four leadframes per cycle
Q5
UPH:                                    500
Maxi leadframe dimensions:    280 x 60 x 1 h mm
Mini leadframe dimensions:     130x25x0.2 h mm
Conveyor:                             5 lanes adjustable in width
Five leadframes per cycle

Dimensions:                          700 x 1700 x 1400h mm (including PC/ Monitor)
Weight:                                400 Kg
Power:                                 Single Phase 100-240 V 50 /60Hz, 2.5 KVA
Air:                                      Dry 3—6 bar
RF:                                      600 Watts @13.56 Mhz + Auto Tuner
Exhaust port:                        NW25 
1 gas line standard + 1 optional
CE Certified 
Safety covers and interlocks
 

Quadrio includes a multiple magazine loading/unloading unit, giving the advantage of loading/unloading single leadframes directly from four or five magazines in one time.
Leadframes are loaded four or five at a time in the plasma chamber from four or five magazines and once the plasma cleaning process is finished, the leadframes are placed back into the same magazine slot they originally came from.
The plasma chamber is equipped with a door to allow loading of the leadframes.
Once in the chamber, the products are brought to vacuum in a few seconds, process gas is inserted and plasma is activated.
Once the plasma time has expired, the chamber is vented and the products are reloaded into the magazines.
At this point the magazines index to the next magazine slot and the cycle starts over again.

This system is suitable for medium pressure plasma processes in the range of 0.15 to 0.9 mbar and can operate with the following gases:

• AR/H2 95/5 %
• N2/H2 95/5 %
• AR/O2 in various mix ranges
• O2
• Other gases at request