AEON - HP
High Power - Batch Plasma System
Applications
Aeon-HP is a high-performance, table-top batch plasma cleaning system which has been designed to perform higher power plasma processes in a consistent and continuous matter.
Aeon-HP has integrated temperature monitoring as well as a specially designed heat dissipation system allowing to perform long, high-power processes in a continuous manner.
Because of these characteristics, Aeon-HP can be used for all the standard plasma cleaning and activation applications, such as:
Plasma cleaning before wire-bonding on modules
Plasma cleaning before transfer molding on modules
Plasma cleaning before under-fillÂ
Plasma cleaning on PCBs, BGAÂ substrates
Aeon-HP can be used also for more intense processes:
Plasma etching on various organic surfaces
Polymer cross-linking applications
Oxide removal on metal parts with oxide thickness in the micrometer region
Aeon-HP serves a specific range of applications within the Semiconductors, Automotive and Electronics industries where continuous high-power delivery is necessary.
Specifications
Machine type
High-power table-top batch plasma cleaner
Footprint
575W x 936L x 862H mm
Plasma chamber configuration
1 powered electrode and 1 ground electrode, multiple height positions
Max product size
294W x 327L X 84H mm
Min product size
N/A
Plasma generator
600W RF Generator 13.56 MHz
Automatic tuning system
Gas Lines
2 Process gas lines with Mass Flow Controller
Pumping system
Dry vacuum pump 250 L/min
Controller
Win10 LTSC PC with fieldbus
16" Touchscreen
Proprietary SCI software
Facilities
Single phase 110-240V 50/60 Hz, 2.5KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Certifications
CE, S2, S8, Cleanroom ISO7 (10k)
Options
Purge line
600 L/min dry vacuum pump
Kit for using pure hydrogen and hydrogen generator
Compare SCI Systems
Category
High Power
High Power
-
Machine type
High-power table-top batch plasma cleaner
High-power standalone batch plasma cleaner
-
Footprint
575W x 936L x 862H mm
1138W x 1811L x 1469H mm
-
Plasma chamber configuration
1 powered electrode and 1 ground electrode, multiple height positions
1 large holder
-
Max product size
294W x 327L X 84H mm
420W X 430L X 40 mm
-
Min product size
N/A
N/A
-
Plasma generator
600W RF Generator 13.56 MHz
Automatic tuning system
600W RF Generator 13.56 MHz
Automatic tuning system
-
Gas lines
2 Process gas lines with Mass Flow Controller
2 Process gas lines with Mass Flow Controller
1 Purge line
-
Pumping system
Dry vacuum pump 250 L/min
Dry vacuum pump 1000 L/min
-
Controller
Win10 LTSC PC with fieldbus
16" Touchscreen
Proprietary SCI software
Win10 LTSC PC with fieldbus
21" Touchscreen
Proprietary SCI software
-
Facilities
Single phase 110-240V 50/60 Hz, 2.5KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Single phase 110-240V 50/60 Hz
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
-
Certifications
CE, S2, S8, Cleanroom ISO7 (10k)
CE, S2, S8, Cleanroom ISO7 (10k)
-
Options
Purge line
600 L/min dry vacuum pump
Kit for using pure hydrogen and hydrogen generator
Kit for using pure hydrogen and hydrogen generator
Dry vacuum pump 1670 L/min
-