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Everything You Need to Know About the Wire Bonding Process

Updated: Aug 17, 2023

Wire bonding is a technique used in the manufacturing of electronic devices, such as integrated circuits. Think of wire bonding as a way to connect the tiny electrical wires within a chip to the outside world or to other parts of a circuit. It's like creating tiny electrical bridges to enable the flow of electrical signals. Plasma cleaning is an important element in the wire bonding process that helps ensure the cleanliness and reliability of the bonds.

In this article, we will explain exactly what wire bonding is and how the plasma cleaning process benefits this process. What is wire bonding, and why does plasma cleaning improve its efficiency?

What Is Wire Bonding?

Imagine wire bonding as a high-tech bridge-building project happening within tiny electronic devices. It's like the construction crew creating sturdy connections between an integrated circuit and its packaging. These connections are essential for the integrated circuits to communicate with the outside world or other electronic components.

Think of wire bonding as the superhero that brings all the electronic parts together, making sure they work seamlessly. It's a versatile and cost-effective technique that forms the backbone of most semiconductor packages, ensuring smooth electrical flow even at mind-bogglingly high frequencies. Wire bonding truly connects the dots, allowing electronic devices to perform their magic!

Wire Bonding and Plasma Cleaning

Before wire bonding can take place, it's crucial to have clean and uncontaminated bond pads and semiconductor dies. Plasma cleaning is a method used to achieve this cleanliness by removing organic contaminants and thin oxide layers from the surface of the bond pads and dies.

Plasma, in this context, refers to a weakly ionized gas that contains charged particles. In the plasma cleaning process, the bond pads are exposed to a controlled plasma environment. This plasma consists of ions, electrons, and neutral gas species.

The plasma interacts with the surface of the bond pads, effectively removing any organic contaminants present. Organic contaminants can come from various sources, such as dust, oils, fingerprints, or residues from previous manufacturing steps. By subjecting the bond pads to the plasma, these contaminants are broken down and removed, leaving a clean surface.

Wire Bonding in Integrated Circuits

During the wire bonding process, thin wires are carefully attached to specific points on the integrated circuits using a special machine called a wire bonder. These wires act as conductors, allowing electrical signals to pass through them. Wire bonding is a widely used and cost-effective method for creating these connections, and it is commonly used in the production of semiconductors.

Plasma cleaning, ahead of wire bonding, can be implemented in different ways, either as an inline solution or as a standalone process step with specialized loading arrangements. The choice of implementation depends on the specific requirements of the manufacturing process.

What Do I Need for Wire Bonding and Plasma Cleaning?

To utilize plasma cleaning and wire bonding in the semiconductor industry, several key products and equipment are needed. One essential component is a plasma cleaning system, such as the ones manufactured by SCI Automation under the trademark SCIPLASMA. These plasma cleaning systems are specifically designed to generate and control ionized gases for the cleaning and surface modification processes.

Bond pads are designated areas on the Integrated circuits where wire bonds will be connected. Thin bonding wires, usually made of gold, aluminum, or copper, establish electrical connections between the bond pads and other components.

A wire bonding machine accurately positions and attaches the bonding wires to the Integrated circuits. Lead frames provide support for mounting the integrated circuits (ICs) and serve as connection points for wire bonding. Molding materials are used later on in the manufacturing process to encapsulate the integrated circuits after wire bonding, ensuring their protection and stability.

Plasma cleaning systems, such as those offered by SCI Automation, play a vital role in removing contaminants and modifying the surface conditions of the bond pads. By effectively eliminating organic contamination and oxides, plasma cleaning enhances the bondability of the assembly, resulting in improved wire bonding yield and overall reliability. For more information, take a look at SCI’s Strip plasma cleaning systems.

Work With the Experts at SCI Plasma

Wire bonding is a remarkable technique that connects intricate electrical wires within electronic devices, enabling the flow of electrical signals and allowing them to perform their magic. The importance of plasma cleaning in the wire bonding process cannot be overstated, as it ensures the cleanliness and reliability of the bond pads, laying the foundation for successful connections. SCI Plasma stands as the leading authority in the field of plasma cleaning and wire bonding.

When it comes to plasma cleaning and wire bonding, look no further than SCI Plasma. With their wealth of knowledge and expertise accumulated over decades, they are the true specialists in this field. Whether you need assistance with wire bonding, plasma cleaning, or any other plasma-related endeavors, their team of experts is ready to guide you every step of the way. Together, you can take your project to unprecedented heights and make your vision a reality.

Don't miss out on the opportunity to work with the best in the field — contact SCI Plasma today and embark on a journey of endless innovation.



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