High-Power Plasma Cleaners for Intensive Surface Treatment
High-power plasma cleaning systems are engineered for applications where stronger plasma density, deeper activation, and higher material removal rates are required. These systems deliver stable, repeatable performance for demanding processes such as oxide removal, polymer cross-linking, and large-area substrate cleaning.
Why Choose High-Power Plasma Cleaning?
Key Advantages
High-intensity plasma for advanced applications
Designed for processes that require strong ion bombardment, aggressive cleaning, or deep activation that cannot be achieved with standard plasma systems.
Uniform treatment for large or complex substrates
Engineered to maintain consistent plasma distribution across wide chambers and irregular geometries without sacrificing uniformity.
Perfect for oxide layer removal
Ideal for removing native oxides from copper, aluminum, and other metals to improve solderability, plating quality, and electrical connectivity.
Enhanced RF power stability and control
Higher power RF generators with advanced tuning ensure reliable plasma ignition and steady performance across varied gases and pressures.
Supports polymer cross-linking processes
High energy density increases polymer surface hardness and stability, enabling stronger adhesion for coatings, films, or encapsulants.
Applications
Surface Treatment Uses
Oxide Removal on Metals
Large Substrate Cleaning
High-Energy Adhesion Improvement
Polymer Cross-Linking and Surface Hardening
Pre-Plating and Pre-Solder Cleaning
Industries That Benefit From High-Power Plasma Cleaning
Semiconductor packaging & assembly
PCB fabrication
Automotive electronics
Plastics & polymer processing
Medical device manufacturing
Optical and display manufacturing
How Strip Plasma Cleaning Works
This video explains how recipes are created and selected, how different gases activate or clean surfaces before key steps like wire bonding or molding, and why strip-in-magazine processing eliminates the automation risks of strip-to-strip systems.
It also covers cycle time planning, RP power tuning, and how stable plasma conditions ensure consistent results in semiconductor packaging.